2015年6月3日星期三

8 Steps to Win at Search, Social & Content Marketing


As Internet usage has increased more than tenfold over the past twenty years, the way people consume information has changed dramatically.

As a result, it’s not enough for businesses to have an “online presence.” To be successful, brands must provide the information their audience is seeking in the right way, the right format and the right place… all while following SEO, social media and content marketing best practices.
1.Strategy Development
Developing a holistic strategy is the first step to success with any business initiative, and the same is true for online marketing. Your strategy should be focused on effectively reaching your audience online, but should also support the business’ overall goals and objectives – the main goal typically being to drive revenue.

In addition to outlining your goals, to create an effective strategy you’ll need to consider the following:

What are our benchmarks? Record benchmarks of your traffic, conversions, leads, cost per lead, etc. to better measure success over the course of time.
Who are we trying to reach? Research your audience and where they hang out online, as this is where you need to be.
Who is involved internally? Identify internal stakeholders and their roles in the content marketing process.
How will we measure success? What metrics will you measure against? What does success look like to your business?

2.Ideation
Once you have developed a strategy, it’s time to get the creative juices flowing in the ideation step of the process. Every business has a story – but now it’s time to determine what your business’ story is, and how you are going to tell it.

To do this, first brainstorm how you can help your customers. What issues does your audience face? What problems do customers seek to fix time and time again? What information do people need to make a purchase decision?

Additionally, consider what your competitors are doing to help your audience. Are there gaps in competitor content coverage that you can capitalize on? How can you present the same information better?

The answers to the above questions will help mold your story throughout the ideation stage and provide inspiration for the next step: content creation.

3.Content Creation
With a solid idea of what information your audience wants and what your competitors are (or aren’t) doing in the space, you’re ready to create content. Though online content creation can be relatively low-cost depending on the format, your content can’t be low quality whatsoever. With the amount of content produced growing each day, only the cream of the crop will rise to the top of the SERPs and resonate with audiences.

Keeping that in mind, decide what type or format your content would be best presented in. Some options include:

Product/services pages
Blog posts
Infographics
Videos
Whitepapers
Case studies
As a publisher, you have the opportunity to earn your audience’s trust and turn each visitor into a customer through each and every piece of content you create. Make the most of that opportunity to help, educate and entertain your audience through every word and image on your website.

4.Optimization
In addition to creating content that is useful to your audience, you must optimize your content for search to increase findabiility, while maintaining the overall content quality. Though your content should be created first and foremost for your customers, keep in mind that you ultimately have another audience: the search engines that present your website to users in the SERPs. You’ll need to consider:

Keywords
On-site factors
Meta data
Canonicalization
Duplicate content

Optimizing your content will provide both visitors and search engines more information about your brand. As visitors can take these cues, like title tags and copy headings, into consideration when they are on your website, search engines can use the information to better rank your content for relevant search terms.

5.Content Promotion
Post optimization, your content is ready to be promoted. Your promotion plan will depend largely on the industry you operate in and your audience’s online preferences. If you’re targeting a younger audience, you may promote heavily on Facebook and Instagram. However, if your target audience is adult professionals, you may see the most success by promoting your content on LinkedIn, through media releases and your blog.

Additionally, link building and paid advertising each play a role in content promotion. Legitimate link earning can have positive content marketing results by possibly increasing search engine rankings, and in turn, visibility. Alternatively, pay-per-click and native advertising can increase traffic from users on relevant search pages and other websites.

6.Distribution
Furthermore, content distribution is another key element to winning at search, social and content marketing. While content promotion is about driving people to engage with content on your website, distribution focuses on reaching audiences off site, like on video and presentation sites and in industry publications.

To effectively distribute your content across a variety of channels, consider repurposing content you have previously created that has been successful. Content repurposing allows you to get the most out of your content investment by saving time, money and other resources by means of recycling the same content idea or theme.

For example, a webinar can be recorded and uploaded to YouTube as a video, but additionally, the presenter slides can be added to Slideshare. You can then write a blog post about the same topic, linking to the content posted on other channels. Create content once, but use the same piece many times by editing and tweaking for different platforms.

7.Lead Nurture
After successfully completing the first six steps, you should begin to see the fruits of your labor and find your content working for you – driving leads, customers and revenue. However, though you may be seeing some conversion, not every lead generated is turning into a sale. Luckily, that isn’t something unique to your business, and is to be somewhat expected.

Not every user who engages with your content will be ready to make a purchase. Some users may be doing research for an upcoming purchase and are in the early stages of the buy cycle, while others are possibly comparing vendors, trying to make a purchase decision.

However, disregarding warm, content-downloading leads is bad for both parties. Fortunately, lead nurturing can help turn those warm leads into hot leads. Through lead nurturing, you can help to pull users through the buy cycle by re-messaging with content similar to what they interacted with initially through an e-nurture stream. Similarly, you can set up a triggered delivery of content based on certain actions taken by a prospect through lead scoring.

8.Measurement
Remember those goals you outlined in the first step – developing a documented strategy? Tracking metrics against your goals and benchmarks is the only way to understand how successful your strategy is, where you need to make improvements, and most importantly, calculate your return on investment.

Overall, each of the eight steps in the process is critical to achieving success with search, social and content marketing. From developing a strategy and creating great content to optimizing for search and promoting and distributing across networks and channels, together the eight steps make for a winning approach to online marketing. 

3 Keys to B2B Lead Generation Success

Based on many years of sales experience and evaluation, sales success can be narrowed down to a very simple formula:  3 Keys to Success.  Learn and apply these three keys and you will experience unlimited success.  Slack off in any one of these three key areas and you limit your ability to succeed in strong fashion.  Well, what are these three keys?

1.FOCUS.  Focus is the first key and it is a very important key to success.  In sales, this means focusing on the right task at the right time.  Thumbing through paperwork and prospecting for names through the database during prime calling hours of the business day is not an effective use of your time if your goal is to be a successful Prospect Manager.  It is imperative that you apply the “power of focus” by working on the right task or activity at the right time.  Then, even more importantly, focus on that task while you are working on it and do not get distracted!  Help people around you to understand that you need to focus during this time and that they will need to schedule an appointment during off peak calling hours if they need to meet with you.  Interruptions and distractions take money out of your pocket!

2.ACTIVITY-LEVEL.  Activity-level has everything to do with numbers.  The higher your activity-level (specifically in calling as a Prospect Manager), the higher the probability of your success.  Again, everything in sales can be boiled down to it being a numbers game (especially in the beginning stages of your employment as a Prospect Manager).  If you want to make an impression, you need to increase your activity-level to an all time high to learn as quickly as possible so you can call as soon as possible.  In the Prospect Manager role, calling equals success, money, and career growth.  At this time, success, money, and career growth are the name of the game!

3.FOLLOW-THROUGH.  The difference between being ordinary and extraordinary is that little extra.  Follow-through for any sales professional, and especially a Prospect Manager, is that little extra.  Many people can start things.  However, a true champion actually follows-through and finishes what they start, ensuring their success.  If you leverage follow-through as a Prospect Manager, you will be in control of your own destiny.  Make sure you take control and constantly follow-through by calling those prospects back when you say you will.  Also, make sure you proactively seek to make follow-up calls for the sales people to ensure your original appointments turn into qualified appointments which leads to your income increasing substantially.  Simply put: follow-through for success!

2015年5月28日星期四

bga reballing

http://www.intel.com/content/www/us/en/ ... video.html

Great video ! bga reballing

Things:
- Need the right soldering iron with high heat recovery.
- 10mm tip.
- Proper no clean flux.
- Lint free wipes and alcohol.
- Hot air station.
- Jig.
- BRAND NEW BGA'S (LEAD FREE).
- Solder paste.
- Printing jig.
- squeegees.
- Some good solder wick (i think the junk I have is exactly that).
- Skill.

- Remove BGA.
- Toss BGA
- Clean site in few strokes with proper flux and wick (should be 100% clean).
- Print solder paste on balls (creates strong fillets as stated). After reading an intel rework paper. I clearly see why its uses.
- Reattach chip perfectly so no solder paste is smeared or in places unwanted.
- Rework to intel specs
- Flush chip
- Perfect repair!

2015年5月26日星期二

BGA Rework Station Profile - Advanced

Altec PC410 gives you different temperature reading, It is because the wiring from the connector to the controller.
When the controller heats up it slides also, so it is important to use external TC meter.
When you have timed how long it takes to preheat using bottom IR only to the temp you are aiming at.
Then you use the altec pc410 sr232 and the software to look how good your temperature curve is.

If the curve looks bad you can smooth it by using the lower hotair.
You can start using top ir when you hit 160C top of the pcb this smooth temperatures.

But the key thing that you forgot to tell is that the controllers TC are in different places.
Bottom heater IR temperature is controlled over the IR plates this is why you need to set it higher.
Because it is not the PCB temperature it is reflective heat/radiation from the ir elements.
When the controlling is done like this you also need to tweak PID setting in the temp area where you like to rework. 
This is easy to do make the PID output led blink constantly when you are in the set temp.
It does not matter if the temp slides as long you have constant output.

Top ir is controlled by your TC touching the PCB so this is the real “chip” temperature.
So this is why you need to use ramp 1 that you don’t burn the chip keeping the radiation on too long.

The bottom Hotair is controlled from air flow so if you want same temperature what is in your preheter is giving you measure temperature
from bottom of the pcb above the ir plates and same time under the chip where is the hot air nozzle. Using two TC sensors.

When you set bottom hot air to 222C it is actually 222C in the bottom of the pcb. It depends how close your nozzle is.
When preheating the pcb keep in mind that the bottom nozzle is blowing could air in the bottom, if it is set to zero... could air hmmm 30c air haha desert man.

But really good basic information and I know if beginners do like you
they will succeed at the first try. Great beginners tutorial M8 10+

Understanding Lead Free

Understanding Lead Free


  • Solving the Plumbum (Pb) conundrum
  • The need to be Pb-free
  • Legislation
  • Tackling the issues
  • Industry cooperation
  • Pb-free terminals
  • Pb-free soldering process
  • Roadmap
  • Logistics, Identification and Labeling

Solving the Plumbum (Pb) conundrum

Used in ancient times, lead (or 'Plumbum', Pb, in Latin) is a metal with a long application history. In fact, the word 'plumber' is derived from the Roman use of lead pipes for carrying water. However, when absorbed by the human body, lead is a cumulative poison detrimentally affecting health in several ways. And in children, lead can impede brain development, making them particularly vulnerable to lead poisoning.
Today, lead piping is obsolete and the largest use of lead is in car batteries. But some semiconductor packages and solders used in electronic circuit boards do contain lead. Though these are small quantities, the sheer volume of electronic consumer goods produced today means there is a risk of lead contaminating drinking water1) 2), plants and animals - for example, by acid rain filtering through landfill sites - and that is a concern to all of us.
  • WEEE directive: Proposal for a Directive of the European Parliament and the Council on waste electrical and electronic equipment, 2000/C 365 E/12.
  • Nordic report: Environmental Consequences of Incineration and landfilling of Waste from Electr(on)ic Equipment", S-O Tabermann, B. Carlsson, H. Erichsen, J. B. Legarth and J C. Gregersen, TeamaNord 1995:155, 1995.
Recycling and careful disposal go some way to addressing the lead health hazard but at NXP, we believe prevention is better than cure, i.e. making the manufacturing process Pb-free. We are actively engaged in researching new soldering materials, processes and package-terminal platings with the aim of making our broad product portfolio completely Pb-free in the near future. And in some products, such as the majority of our DIP, SIL and QFN packages, we've been Pb-free for many years.
As a global company committed to environmental care, we cooperate with leading suppliers and customers on a wide range of 'green' issues. It's a commitment we take seriously, so it's not surprising that the first factory in the world to receive ISO 14001 certification was one of ours.
Moreover, our Eco Vision program and Eco-Design philosophy ensure that better products and more environmentally-friendly manufacturing processes lie ahead. And that includes both Pb- and halogen-free products.
'Profitable green' is the name given to NXP Semiconductors' approach to environmental issues. We aim to reduce the environmental impact of our products while providing customers with leading-edge technology at the lowest possible cost. One example of this is our 'green' plastic packaging. Used in all our new LQFP and TQFP packages, this plastic significantly increases product lifetimes at high temperatures, yet it does not contain brominated flame-retardants. Likewise, on the road to a Pb-free future, NXP Semiconductors is leading the way.

The need to be Pb-free

Throughout the electronics industry, the desire for Pb-free electronics is a hot topic. Customers and manufacturers alike are keen to ensure that new regulations in Europe, the US and Far East are complied with, sooner rather than later:
  • In Europe, an EU directive on Restrictions on the use of Hazardous Substances (RoHS) includes a requirement to eliminate Pb in electronics, in all but special applications, by July 1st, 2006
  • In China, the government is working on bringing in similar legislation to the Europeans
  • In Japan, electronic waste and recycling laws oblige manufacturers to eliminate or recover their waste products containing Pb
  • In the United States, laws banning or restricting the use of Pb are coming for many products and there is an increasing demand for a total ban.
The electronics industry is now focused on Pb-free assembly processes and the issues concerning the higher temperatures needed for both reflow and wave Pb-free soldering. By investing heavily in our own research organization, we have developed cost-effective Pb-free manufacturing processes that guarantee the reliability of our components. Moreover, we're being proactive in also looking into solutions for devices where Pb is contained inside the package: replacing Pb-based solders in some Multi-Chip M odules/SiPs with new glues, for example.

Legislation

Formal guidelines have been introduced gradually over several years by various bodies, substantiating NXP's own drive to eliminate lead from electronic products. Two of the most recent and important directives - WEEE (Waste from Electrical and Electronic Equipment) and RoHS (Reduction on Hazardous Substances) - impose better control over waste management of electronic equipment. Of most relevance to component manufacture, the RoHS establishes phase out dates for Pb - along with several other materials - from electronic products. This means by July 1st 2006, amounts of lead and the other named materials contained in electronic products must be below certain limits (unless exempt by special rule).

Tackling the issues

Understanding all the potential risks of going Pb-free is the key to ensuring our future success. By thoroughly addressing the following issues, we're confident that a Pb-free future is just around the corner:
  • Forward compatibility - ensuring "old" products containing Pb still meet customers' requirements and are compatible with both Pb-based and Pb-free solders/PCBs
  • Backward compatibility - ensuring "new" Pb-free products can be used with Pb-based technologies
  • Re-qualification of current products - updating the portfolio with standardized Pb-free solutions
  • Device reliability - coping with higher temperatures in new Pb-free manufacturing/assembly processes (higher temperature leads to increased risk for moisture-sensitivity), and ensuring solder-joint reliability using new materials.
Our strategy to expand our range of Pb-free packages comprises a thorough investigation to tackle all of the above issues, ensuring full compatibility with new soldering processes, and to implement Pb-free materials for the terminals and solder balls on all packages.

Industry cooperation

Present soldering and plating technologies using Pb are well established throughout the semiconductor industry. Likewise, the procedures and standards for evaluating quality and reliability are recognized worldwide. With a large variety of new Pb-free technologies under investigation, NXP Semiconductors has been working together with other leading manufacturers. This is to ensure the methodologies for measuring solderability, heat resistance and whiskering are consistent, to fairly assess all competing technologies. For further details about this cooperation, please see our website.
Though our Pb-free technologies are based on our current research and experience, we are committed to high performance, quality and reliability, and we'll ensure that our products will continue to delight customers.

Pb-free terminals

With many years of experience in using pure tin to coat semiconductor package leads/terminals, we know that tin is the logical choice for a drop-in replacement for those devices currently using SnPb-alloy coatings. We have studied whiskering with tin finishes, focusing on the leads of surface-mount devices and the results proved successful. Extensive testing for all packages is now completed.
Pure Sn, NiPdAu and SAC offer a very compatible replacement for SnPb alloys and consequently they are our preferred solution. In exceptional circumstances when pure tin is not feasible, we will offer alternative alloys. For the contacts of Ball-Grid Arrays (BGAs), we selected SnAgCu alloy (SAC).

Pb-free soldering process

Based on current research, we advise using SnAg3.8Cu0.7 (SAC) eutectic solder for general-purpose applications. In wave soldering, this would entail a bath temperature of 260 °ree;C and a contact time of about 3 seconds. Similar alloy would also be used for reflow soldering. Our temperature profile (see below) for moisture sensitivity characterization is based on the IPC/JEDEC joint industry standard: J-STD-020C.
Figure: Classification Reflow Profile
Pb-free profile feature and specification

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to TP)3°C/second max
Preheat Temperature Min (Tsmin)150°C
Preheat Temperature Max (Tsmax)200°C
Preheat Temperature (Tsmin to Tsmax)60-180 sec
Time maintained above Temperature (TL)217°C
Time maintained above Time (TL)60-150 sec
Peak/Classification Temperature (TP)See table below
Time within 5° C of actual Peak Temperature P20-40 seconds
Ramp-Down Rate6°C/second max
Time 25° C to Peak Temperature8 minutes max
Note: All temperatures refer to topside of the package, measured on the package body surface
Pb-free Process - Package Classification Reflow Temperatures

Package Body Thickness

Package Volume <350 mm3

Package Volume 350 to 2000 mm3

Package Volume >2000 mm3

< 1.6 mm260°C260°C260°C
1.6 to 2.5 mm260°C250°C245°C
> 2.5 mm250°C245°C245°C
Our current research indicates that higher soldering temperatures affect a number of surface mount devices. It is advised to keep the package top-body temperature at 245 ºC max. Work continues to improve the resistivity of the products to high soldering temperatures. In addition, NXP Semiconductors is assessing mechanical stress and fracturing in ceramic and glass components - SAC is stronger than Pb-based solders.

Roadmap

NXP Semiconductors is now fully compliant with new regulations - well ahead of the European legislation. To check if an individual part is Pb free, enter a part number in the search box. For our roadmap overview see our lead-free package matrixpage. Please note that certain applications are exempt by RoHS regulations and so lead-containing products may be used in these areas.

Logistics, Identification and Labeling

Special product labeling will be used to identify Pb-free shipments. There are 3 ways for identification
  • A special Pb-free symbol on reel, bag and PQ box (and a different symbol for RoHS exempt packages) Lead-free products are not mixed with lead containing products within a single packing quantity (PQ).
  • A marked symbol on the package (if space allows). Individual products will be marked with a one-digit code, G, E or N. (G = Pb-free/green, E = RoHS allowable exemption and N = not-Pb-free).
  • By weekcode (backwards traceability)
Part numbers will remain the same (except new BGA parts, because of their non-backward compatibility) since most customers want part numbers to be kept consistent. There are several reasons for this, such as planning and capacity considerations, the need to control old parts (and avoid stock that needs scrapping), and the desire to reduce the logistics consequences for the supply chain.
All new Pb-free products are backward production compatible (except BGAs) meaning that they can be used in both a Pb-free and a Pb-based soldering process, which simplifies the manufacturing choices. As with any change it may be necessary to re-optimize the soldering processes.

solder ball size for game console reballing

solder ball size for game console reballing

1x PS3 GPU (0.6mm Soler Ball)
1x PS3 CPU(old version) (0.6mm Soler Ball)
1x PS3 CPU(new version) (0.6mm Soler Ball) 
1x PS3 CXR714120 (0.6mm Soler Ball)
1x PS3 CXD2964GB (0.6mm Soler Ball) 
1x PS3 CXD2973GB (0.6mm Soler Ball) 
1x CXD2949CGB (0.76mm Soler Ball)
1x CXD9799GP (0.76mm Soler Ball)
1x CXD9833GB (0.76mm Soler Ball)
1x CXD2980BGB (0.6mm Soler Ball)
1x CXD9209GB (0.6mm Soler Ball)
1x CXD2976GB (0.6mm Soler Ball)
1x CXD2992GB (0.6mm Soler Ball)
1x CXDT203-15 (0.76mm Soler Ball)
1x CXD2981GB (0.6mm Soler Ball)
XBOX 360 GPU (0.6mm Soler Ball)
XBOX 360 CPU (0.6mm Soler Ball)
XBOX 360 CSP (0.6mm Soler Ball)
XBOX 360 HANA (0.6mm Soler Ball)
XBOX 360 RAM (0.45mm solder ball)

Repair - Motherboard

onto the repair, here are some items your gonna need, most you will likely have already:

Soldering station
(Unleaded) solder
Solder wick/braid
Fibreglass pen (If you don't have this you can use an exacto knife or razor but the fibreclass pen is by far the best and safest)
Liquid flux, preferably INSAT
Paste Flux
A magnifying glass (must have high powered magnifying range) or microscope.
Solder Mask
Toothpick (for applying flux paste and solder mask)


IMPORTANT :!: 
This is just my technique to do this repair, and it works great for me, I'm not saying it's the best method, this is not an easy repair and definitely not for a novice, as a minimum I would say you need some standard trace repair experience either using bridged solder or preferably using low gauge kynar wire. I have tried to make it as easy as possible though :D 

The traces from the GPU are incredibly close together, this is why we are using braid/wick copper wire and a high powered magnifying glass


Ok so lets move on.

So the first thing you want to do is get your braid and dissect it a little, the easiest way i found was to pull each side and it it will begin to unravel. what we want are those single strands of the braid, once you have some you want to put some flux paste on them and tin with your unleaded solder.

TIP :idea: 

you could pick up a ball of unleaded solder with the entire wick and unravel the individual wires while it's still hot - its another option


Now you want to clean up your board with IPA or thinner, I pretty much use standard thinner for everything these days but each to their own. once it's all clean you will want to expose the copper traces, of the points you want to solder from, you will do this with your fibreglass pen, exacto knife or razor. (see below).

Image

Clean the board up again.

You now want to tin your traces, with unleaded solder, the easiest way to do this is run your wick and some flux over the trace, you will find that a thin layer of solder will be attracted to the traces, just what we need.

Now get your insat and rub it over the tinned traces with a brush, wait a few minutes for it to get sticky, now you really need that magnifying glass, position the tinned wire on the trace with some tweezers, it should stick nicely cause of the INSAT, you want the wire going right into the pad area, it should reach one side of the pad fully to the opposite side of the pad (but no more).

Again using your magnifying glass gently tap along the wire at 1 second intervals from one end to the other (depending how long your trace needs to be, any size is fine actually), feel free to use a pair of tweezers to support the wire also and keep in mind that it might only take one tap to flow the wire to the trace, don't hold the iron on the trace cause you could sever it.

Finally test the continuity of the new points with a DMM, use the two furthest points of the exposed trace to confirm you did a good job.

Gently clean up the area, use Thinner then IPA or just IPA this time.


Image
I actually redid the point closest to the bottom of the site as I was not happy that the wire did not fully cover the pad 

Use a toothpick and some solder mask to tidy up the exposed parts of the board.

The reason we used unleaded solder is cause you will put a leaded GPU back on the board, the unleaded solder will stand firm at 190C meaning the solder ball will flow straight onto the trace wire you just created. ;) 

A word of caution, although your joints should be relatively solid, be aware not to mess around too much with the seating of the GPU before reflowing to the board, remember that the unleaded solder balls will automatically shift the GPU to its correct position in reflow state if your not exact.

I am not a big fan of the wire glues in the market, I tried them in the past on damaged pads I found they didn't hold upto the temps, plus I'm always wary of using glues on PCB's to form circuits. Maybe there are better ones now? I also heard of copper tape being used (the scaletrix type but again I would be worried about how adhesive would react at 190C but I'm happy with using unleaded solder as I know it will form as good a connection as you will get and be solid at leaded reflow temps.

Another option to consider, and you can incorporate this into the above guide if you like is to place a small amount of solder in the pad and then heat with a a hot air wand, it should naturally be attracted to the small trace repair you did, but these are all just ideas, you can play with.

Apologies for the pics, getting pcs of those tiny points is tough, if you open them and zoom in, you can see the points relatively clearly though... ;)