bga reballing

http://www.intel.com/content/www/us/en/ ... video.html

Great video ! bga reballing

Things:
- Need the right soldering iron with high heat recovery.
- 10mm tip.
- Proper no clean flux.
- Lint free wipes and alcohol.
- Hot air station.
- Jig.
- BRAND NEW BGA'S (LEAD FREE).
- Solder paste.
- Printing jig.
- squeegees.
- Some good solder wick (i think the junk I have is exactly that).
- Skill.

- Remove BGA.
- Toss BGA
- Clean site in few strokes with proper flux and wick (should be 100% clean).
- Print solder paste on balls (creates strong fillets as stated). After reading an intel rework paper. I clearly see why its uses.
- Reattach chip perfectly so no solder paste is smeared or in places unwanted.
- Rework to intel specs
- Flush chip
- Perfect repair!

BGA Rework Station Profile - Advanced

Altec PC410 gives you different temperature reading, It is because the wiring from the connector to the controller.
When the controller heats up it slides also, so it is important to use external TC meter.
When you have timed how long it takes to preheat using bottom IR only to the temp you are aiming at.
Then you use the altec pc410 sr232 and the software to look how good your temperature curve is.

If the curve looks bad you can smooth it by using the lower hotair.
You can start using top ir when you hit 160C top of the pcb this smooth temperatures.

But the key thing that you forgot to tell is that the controllers TC are in different places.
Bottom heater IR temperature is controlled over the IR plates this is why you need to set it higher.
Because it is not the PCB temperature it is reflective heat/radiation from the ir elements.
When the controlling is done like this you also need to tweak PID setting in the temp area where you like to rework. 
This is easy to do make the PID output led blink constantly when you are in the set temp.
It does not matter if the temp slides as long you have constant output.

Top ir is controlled by your TC touching the PCB so this is the real “chip” temperature.
So this is why you need to use ramp 1 that you don’t burn the chip keeping the radiation on too long.

The bottom Hotair is controlled from air flow so if you want same temperature what is in your preheter is giving you measure temperature
from bottom of the pcb above the ir plates and same time under the chip where is the hot air nozzle. Using two TC sensors.

When you set bottom hot air to 222C it is actually 222C in the bottom of the pcb. It depends how close your nozzle is.
When preheating the pcb keep in mind that the bottom nozzle is blowing could air in the bottom, if it is set to zero... could air hmmm 30c air haha desert man.

But really good basic information and I know if beginners do like you
they will succeed at the first try. Great beginners tutorial M8 10+

Understanding Lead Free

Understanding Lead Free

• Solving the Plumbum (Pb) conundrum
• The need to be Pb-free
• Legislation
• Tackling the issues
• Industry cooperation
• Pb-free terminals
• Pb-free soldering process
• Roadmap
• Logistics, Identification and Labeling

Solving the Plumbum (Pb) conundrum

Used in ancient times, lead (or 'Plumbum', Pb, in Latin) is a metal with a long application history. In fact, the word 'plumber' is derived from the Roman use of lead pipes for carrying water. However, when absorbed by the human body, lead is a cumulative poison detrimentally affecting health in several ways. And in children, lead can impede brain development, making them particularly vulnerable to lead poisoning.

Today, lead piping is obsolete and the largest use of lead is in car batteries. But some semiconductor packages and solders used in electronic circuit boards do contain lead. Though these are small quantities, the sheer volume of electronic consumer goods produced today means there is a risk of lead contaminating drinking water1) 2), plants and animals - for example, by acid rain filtering through landfill sites - and that is a concern to all of us.

• WEEE directive: Proposal for a Directive of the European Parliament and the Council on waste electrical and electronic equipment, 2000/C 365 E/12.
• Nordic report: Environmental Consequences of Incineration and landfilling of Waste from Electr(on)ic Equipment", S-O Tabermann, B. Carlsson, H. Erichsen, J. B. Legarth and J C. Gregersen, TeamaNord 1995:155, 1995.

Recycling and careful disposal go some way to addressing the lead health hazard but at NXP, we believe prevention is better than cure, i.e. making the manufacturing process Pb-free. We are actively engaged in researching new soldering materials, processes and package-terminal platings with the aim of making our broad product portfolio completely Pb-free in the near future. And in some products, such as the majority of our DIP, SIL and QFN packages, we've been Pb-free for many years.

As a global company committed to environmental care, we cooperate with leading suppliers and customers on a wide range of 'green' issues. It's a commitment we take seriously, so it's not surprising that the first factory in the world to receive ISO 14001 certification was one of ours.

Moreover, our Eco Vision program and Eco-Design philosophy ensure that better products and more environmentally-friendly manufacturing processes lie ahead. And that includes both Pb- and halogen-free products.

'Profitable green' is the name given to NXP Semiconductors' approach to environmental issues. We aim to reduce the environmental impact of our products while providing customers with leading-edge technology at the lowest possible cost. One example of this is our 'green' plastic packaging. Used in all our new LQFP and TQFP packages, this plastic significantly increases product lifetimes at high temperatures, yet it does not contain brominated flame-retardants. Likewise, on the road to a Pb-free future, NXP Semiconductors is leading the way.

The need to be Pb-free

Throughout the electronics industry, the desire for Pb-free electronics is a hot topic. Customers and manufacturers alike are keen to ensure that new regulations in Europe, the US and Far East are complied with, sooner rather than later:

• In Europe, an EU directive on Restrictions on the use of Hazardous Substances (RoHS) includes a requirement to eliminate Pb in electronics, in all but special applications, by July 1st, 2006
• In China, the government is working on bringing in similar legislation to the Europeans
• In Japan, electronic waste and recycling laws oblige manufacturers to eliminate or recover their waste products containing Pb
• In the United States, laws banning or restricting the use of Pb are coming for many products and there is an increasing demand for a total ban.

The electronics industry is now focused on Pb-free assembly processes and the issues concerning the higher temperatures needed for both reflow and wave Pb-free soldering. By investing heavily in our own research organization, we have developed cost-effective Pb-free manufacturing processes that guarantee the reliability of our components. Moreover, we're being proactive in also looking into solutions for devices where Pb is contained inside the package: replacing Pb-based solders in some Multi-Chip M odules/SiPs with new glues, for example.

Legislation

Formal guidelines have been introduced gradually over several years by various bodies, substantiating NXP's own drive to eliminate lead from electronic products. Two of the most recent and important directives - WEEE (Waste from Electrical and Electronic Equipment) and RoHS (Reduction on Hazardous Substances) - impose better control over waste management of electronic equipment. Of most relevance to component manufacture, the RoHS establishes phase out dates for Pb - along with several other materials - from electronic products. This means by July 1st 2006, amounts of lead and the other named materials contained in electronic products must be below certain limits (unless exempt by special rule).

Tackling the issues

Understanding all the potential risks of going Pb-free is the key to ensuring our future success. By thoroughly addressing the following issues, we're confident that a Pb-free future is just around the corner:

• Forward compatibility - ensuring "old" products containing Pb still meet customers' requirements and are compatible with both Pb-based and Pb-free solders/PCBs
• Backward compatibility - ensuring "new" Pb-free products can be used with Pb-based technologies
• Re-qualification of current products - updating the portfolio with standardized Pb-free solutions
• Device reliability - coping with higher temperatures in new Pb-free manufacturing/assembly processes (higher temperature leads to increased risk for moisture-sensitivity), and ensuring solder-joint reliability using new materials.

Our strategy to expand our range of Pb-free packages comprises a thorough investigation to tackle all of the above issues, ensuring full compatibility with new soldering processes, and to implement Pb-free materials for the terminals and solder balls on all packages.

Industry cooperation

Present soldering and plating technologies using Pb are well established throughout the semiconductor industry. Likewise, the procedures and standards for evaluating quality and reliability are recognized worldwide. With a large variety of new Pb-free technologies under investigation, NXP Semiconductors has been working together with other leading manufacturers. This is to ensure the methodologies for measuring solderability, heat resistance and whiskering are consistent, to fairly assess all competing technologies. For further details about this cooperation, please see our website.

Though our Pb-free technologies are based on our current research and experience, we are committed to high performance, quality and reliability, and we'll ensure that our products will continue to delight customers.

Pb-free terminals

With many years of experience in using pure tin to coat semiconductor package leads/terminals, we know that tin is the logical choice for a drop-in replacement for those devices currently using SnPb-alloy coatings. We have studied whiskering with tin finishes, focusing on the leads of surface-mount devices and the results proved successful. Extensive testing for all packages is now completed.

Pure Sn, NiPdAu and SAC offer a very compatible replacement for SnPb alloys and consequently they are our preferred solution. In exceptional circumstances when pure tin is not feasible, we will offer alternative alloys. For the contacts of Ball-Grid Arrays (BGAs), we selected SnAgCu alloy (SAC).

Pb-free soldering process

Based on current research, we advise using SnAg3.8Cu0.7 (SAC) eutectic solder for general-purpose applications. In wave soldering, this would entail a bath temperature of 260 °ree;C and a contact time of about 3 seconds. Similar alloy would also be used for reflow soldering. Our temperature profile (see below) for moisture sensitivity characterization is based on the IPC/JEDEC joint industry standard: J-STD-020C.

Figure: Classification Reflow Profile

Pb-free profile feature and specification
Profile Feature	Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to TP)	3°C/second max
Preheat Temperature Min (Tsmin)	150°C
Preheat Temperature Max (Tsmax)	200°C
Preheat Temperature (Tsmin to Tsmax)	60-180 sec
Time maintained above Temperature (TL)	217°C
Time maintained above Time (TL)	60-150 sec
Peak/Classification Temperature (TP)	See table below
Time within 5° C of actual Peak Temperature P	20-40 seconds
Ramp-Down Rate	6°C/second max
Time 25° C to Peak Temperature	8 minutes max

Note: All temperatures refer to topside of the package, measured on the package body surface

Pb-free Process - Package Classification Reflow Temperatures
Package Body Thickness	Package Volume <350 mm3	Package Volume 350 to 2000 mm3	Package Volume >2000 mm3
< 1.6 mm	260°C	260°C	260°C
1.6 to 2.5 mm	260°C	250°C	245°C
> 2.5 mm	250°C	245°C	245°C

Our current research indicates that higher soldering temperatures affect a number of surface mount devices. It is advised to keep the package top-body temperature at 245 ºC max. Work continues to improve the resistivity of the products to high soldering temperatures. In addition, NXP Semiconductors is assessing mechanical stress and fracturing in ceramic and glass components - SAC is stronger than Pb-based solders.

Roadmap

NXP Semiconductors is now fully compliant with new regulations - well ahead of the European legislation. To check if an individual part is Pb free, enter a part number in the search box. For our roadmap overview see our lead-free package matrixpage. Please note that certain applications are exempt by RoHS regulations and so lead-containing products may be used in these areas.

Logistics, Identification and Labeling

Special product labeling will be used to identify Pb-free shipments. There are 3 ways for identification

• A special Pb-free symbol on reel, bag and PQ box (and a different symbol for RoHS exempt packages) Lead-free products are not mixed with lead containing products within a single packing quantity (PQ).
• A marked symbol on the package (if space allows). Individual products will be marked with a one-digit code, G, E or N. (G = Pb-free/green, E = RoHS allowable exemption and N = not-Pb-free).
• By weekcode (backwards traceability)

Part numbers will remain the same (except new BGA parts, because of their non-backward compatibility) since most customers want part numbers to be kept consistent. There are several reasons for this, such as planning and capacity considerations, the need to control old parts (and avoid stock that needs scrapping), and the desire to reduce the logistics consequences for the supply chain.

All new Pb-free products are backward production compatible (except BGAs) meaning that they can be used in both a Pb-free and a Pb-based soldering process, which simplifies the manufacturing choices. As with any change it may be necessary to re-optimize the soldering processes.

solder ball size for game console reballing

solder ball size for game console reballing

1x PS3 GPU (0.6mm Soler Ball)
1x PS3 CPU(old version) (0.6mm Soler Ball)
1x PS3 CPU(new version) (0.6mm Soler Ball) 
1x PS3 CXR714120 (0.6mm Soler Ball)
1x PS3 CXD2964GB (0.6mm Soler Ball) 
1x PS3 CXD2973GB (0.6mm Soler Ball) 
1x CXD2949CGB (0.76mm Soler Ball)
1x CXD9799GP (0.76mm Soler Ball)
1x CXD9833GB (0.76mm Soler Ball)
1x CXD2980BGB (0.6mm Soler Ball)
1x CXD9209GB (0.6mm Soler Ball)
1x CXD2976GB (0.6mm Soler Ball)
1x CXD2992GB (0.6mm Soler Ball)
1x CXDT203-15 (0.76mm Soler Ball)
1x CXD2981GB (0.6mm Soler Ball)
XBOX 360 GPU (0.6mm Soler Ball)
XBOX 360 CPU (0.6mm Soler Ball)
XBOX 360 CSP (0.6mm Soler Ball)
XBOX 360 HANA (0.6mm Soler Ball)
XBOX 360 RAM (0.45mm solder ball)

Repair - Motherboard

onto the repair, here are some items your gonna need, most you will likely have already:

Soldering station
(Unleaded) solder
Solder wick/braid
Fibreglass pen (If you don't have this you can use an exacto knife or razor but the fibreclass pen is by far the best and safest)
Liquid flux, preferably INSAT
Paste Flux
A magnifying glass (must have high powered magnifying range) or microscope.
Solder Mask
Toothpick (for applying flux paste and solder mask)

IMPORTANT  
This is just my technique to do this repair, and it works great for me, I'm not saying it's the best method, this is not an easy repair and definitely not for a novice, as a minimum I would say you need some standard trace repair experience either using bridged solder or preferably using low gauge kynar wire. I have tried to make it as easy as possible though  

The traces from the GPU are incredibly close together, this is why we are using braid/wick copper wire and a high powered magnifying glass

Ok so lets move on.

So the first thing you want to do is get your braid and dissect it a little, the easiest way i found was to pull each side and it it will begin to unravel. what we want are those single strands of the braid, once you have some you want to put some flux paste on them and tin with your unleaded solder.

TIP  

you could pick up a ball of unleaded solder with the entire wick and unravel the individual wires while it's still hot - its another option

Now you want to clean up your board with IPA or thinner, I pretty much use standard thinner for everything these days but each to their own. once it's all clean you will want to expose the copper traces, of the points you want to solder from, you will do this with your fibreglass pen, exacto knife or razor. (see below).



Clean the board up again.

You now want to tin your traces, with unleaded solder, the easiest way to do this is run your wick and some flux over the trace, you will find that a thin layer of solder will be attracted to the traces, just what we need.

Now get your insat and rub it over the tinned traces with a brush, wait a few minutes for it to get sticky, now you really need that magnifying glass, position the tinned wire on the trace with some tweezers, it should stick nicely cause of the INSAT, you want the wire going right into the pad area, it should reach one side of the pad fully to the opposite side of the pad (but no more).

Again using your magnifying glass gently tap along the wire at 1 second intervals from one end to the other (depending how long your trace needs to be, any size is fine actually), feel free to use a pair of tweezers to support the wire also and keep in mind that it might only take one tap to flow the wire to the trace, don't hold the iron on the trace cause you could sever it.

Finally test the continuity of the new points with a DMM, use the two furthest points of the exposed trace to confirm you did a good job.

Gently clean up the area, use Thinner then IPA or just IPA this time.


I actually redid the point closest to the bottom of the site as I was not happy that the wire did not fully cover the pad 

Use a toothpick and some solder mask to tidy up the exposed parts of the board.

The reason we used unleaded solder is cause you will put a leaded GPU back on the board, the unleaded solder will stand firm at 190C meaning the solder ball will flow straight onto the trace wire you just created.  

A word of caution, although your joints should be relatively solid, be aware not to mess around too much with the seating of the GPU before reflowing to the board, remember that the unleaded solder balls will automatically shift the GPU to its correct position in reflow state if your not exact.

I am not a big fan of the wire glues in the market, I tried them in the past on damaged pads I found they didn't hold upto the temps, plus I'm always wary of using glues on PCB's to form circuits. Maybe there are better ones now? I also heard of copper tape being used (the scaletrix type but again I would be worried about how adhesive would react at 190C but I'm happy with using unleaded solder as I know it will form as good a connection as you will get and be solid at leaded reflow temps.

Another option to consider, and you can incorporate this into the above guide if you like is to place a small amount of solder in the pad and then heat with a a hot air wand, it should naturally be attracted to the small trace repair you did, but these are all just ideas, you can play with.

Apologies for the pics, getting pcs of those tiny points is tough, if you open them and zoom in, you can see the points relatively clearly though... 

What is the best advice for a young, first-time startup CEO?

 Here are a few things I wish we knew when we first started:

1. Determination is the biggest predictor of long-term success: Many inspirational founders shared their stories, including the CEOs of Pinterest and AirBnB. Nobody had an easy road. The AirBnB founders — with a company now valued at US$10-billion — had a famous story of hot gluing 1,000 cereal boxes to pay expenses in the early days. You can succeed, but often it is a matter of how badly you want to.
2. You will grow what you measure: Take a sticky note, and write one goal on it. Be specific. Now place it on your bathroom mirror, so that each morning you’re reminded of your No. 1 growth priority. If you’re building a company, this should be a week-over-week metric such as users or revenue.
3. Do not mistake activity for growth: Startup founders often don’t know what truly constitutes growth. Adding features to your product is not growth. Neither is getting a fancy office or going to a lot of events. Adding customers and building product counts as growth — that’s about it.
4. The key to growth is progress: If you’re not moving forward, here is a way to get tasks done through a life hack called workstation popcorn. You start with a list of three tasks, each with sub tasks. You go to three coffee shops and only move to the next one when you’re done a task. Make progress each day and you win.
5. The winner between the alligator and the bear is determined by the terrain: Not everyone is good at everything. Negotiate on your territory and play up your strengths.
6. Make decisions quickly: This can be hard for first time founders, but remember that time is a cost. There are 24 hours in a day, and only about 10% of the information needed to make most decisions. Understand the magnitude of decisions you are required to make and prioritize accordingly. Train yourself to become decisive, so you can move forward with execution.
7. Do not focus too much on competition: If I decided to become a basketball player tomorrow, do you think it would affect LeBron James’ career? Ignore the noise, because what others are doing is out of your control and they’re probably amateurs. Be aware of the players in the space you are in, but focus on getting to the top of your game.
8. There is no substitute for hard work: When we first started market-testing 42, I spent weeks walking in and out of stores asking to speak with every associate and store manager. It was tough, but also gave me the most eye-opening insights. There’s no way around pushing code or making sales calls. The good news is that the tougher it is for you, the more difficult it is for others to replicate.
9. Opportunity is everywhere: The first time I visited Silicon Valley I was very disappointed. There was no teleportation, no wireless ports, not even robots who greeted you at reception. Now I see it as great news, it means there are still countless opportunities for you to introduce ideas that will shape our future. Do NOT play victim (I'm too young, inexperienced, don't have this or that) - just get building.

Good luck!

iPhone 5 Glass Replacement

here experience doing a iPhone 5 GLASS ONLY replacement? Methods of removing the LCD and cleaning the adhesive on it? 

Here's the method
MAKE SURE to take the backlight off the LCD, desolder it, and put tape on the rear of the LCD and Xacto around the edges ( be careful around the top by the ribbons it will break off)
-put a dummy backlight into the mold to mimick the regular height
-Loca the glass to the lcd
-before putting the backlight back on make sure and put tape down on the sides of the lcd that are the "rails" connecting the top and bottom. its the only way to get the frame to stick to the screen
-Solder backlight back on and make sure no light leaks out.
-put frame back on
-Refurbished!

wespro ns722 hang on logo

wespro ns722 hang on logo, how to install os?
try this

turn off computer
disconnect adapter
unplug battery
press and hold power buttun for 10 seconds
then release it
wait 30 minutes
plug battery
plug adapter

turn on computer

ZM-R6200 bga rework station

Summary

◆ 3 independent heating system
ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater departly, and combine freely with top and bottom heater’s capacity,to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time.


◆ Precise optical alignment system
with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12” HD monitor.


◆ Multi-function operation system
With touch screen interface, k-type thermocouple, close-loop control, and Intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. it can auto identify a high degree of suction and mounting. with automatic soldering and desoldering functions. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set.


◆ Superior safety functions
after finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation

How to Reset a Lost Admin Password on Mac OS X

Two Methods:Using System Preferences and Using Single-User Mode
If your Apple is running OS X, and you are having trouble accessing the administrator's account, follow these few easy steps that will get you full administrative control.
Method 1 of 2: Using System Preferences

1. Go to the Apple menu in the upper right hand side of the screen and click "Log out username".

2.On the accounts presented in the menu select the admin account and enter the password.If you keep on failing, it will ask for your master password that can be changed at the Security menu in system preferences.

Method 2 of 2: Using Single-User Mode

Forget your password to the only administrator account on your Mac? Unable to install software or even log in because you just can't remember which one of your favorite pets you used for the password? Or do you need to access the Super-User (root) account to make changes not allowed even to Administrators?

No worries! We're going to reset that pesky password without losing any of your data or files - and it only takes about five minutes!

1.Access Single-User mode.

(1)Shutdown your computer. (Turn it right off - do not restart.)

(2)Use your left hand to hold down the 'Apple' or 'Command' key on the keyboard (directly beside the space bar) and the letter 'S' . Hold both of these together and do not let go through the next step.Turn the computer on, ensuring that you are still holding the 'Command' and 'S' keys.

(3)Wait until you see a bunch of white writing scrolling by on a black screen. You can release the keys, and you are now in Single-User mode. The computer is ready to continue when you see localhost:/ root# or something similar as the very last line on the screen.

2 Check the drive for errors. Next we want to check the drive for errors (and fix them if there are any). We do this because of the power of Single-User Mode, we do not want to be making massive changes to the file-system if there are underlying issues which could be made worse. Right after the # on the last line of the screen type fsck -fy and press [Return] when the process is finished (approximately two to three minutes) you will seelocalhost:/ root# (henceforth referred to as the prompt) again.

3 Access the drive so that we can make changes. Before you can reset your password you need to mount the drive; this will allow you to make changes to files. At the prompt type mount -uw / and press [Return].

4 Reset the password.

(1)Type launchctl load /System/Library/LaunchDaemons/com.apple.opendirectoryd.plist and press [Return].

(2)Type ls /Users and press [Return]. A list of all of the accounts on your computer will be listed along with 'Public'

(3)Type dscl . passwd /Users/username password while replacing username with one of the users displayed in the previous step and replacing password with the new password of your choice. Press [Return]. Ignore error message appearing after entering this command.

5 Restart the computer and try the new password. At the prompt type reboot[Return]. The computer will restart and you will now be able to use your new password.